Long dominated by foreign firms, the high-end HDI and high-multilayer PCB sector has seen domestic enterprises achieve key breakthroughs in materials, processes, and equipment via R&D investment, accelerating import substitution.
Domestically, high-Tg FR-4 (Shengyi S1000), low-loss 高速基材，and high-frequency materials now match import performance, breaking material monopolies. Processes like 64-layer lamination, any-layer HDI laser drilling/plating, and mSAP fine lines meet IPC Class 2 standards.
Equipment localization (laser drills, vacuum laminators, AOI) has built a complete 'material-equipment-process' supply chain. Domestic leaders now rank globally, supplying AI/5G/autonomous driving giants, with localization rates rising from 30% (2018) to 60%+ (2025), achieving self-reliance.
