Quality & Technology Empowerment：

1、 Quality Control Process 

2、 Core technology and patent advantages 

3、 Service features (customization, full cycle, high responsiveness)

Quality control process (closed-loop control throughout the entire process)

1. Incoming Quality Control (IQC)

Supplier admission: Strictly review supplier qualifications, establish a qualified list, and conduct regular assessments.

Incoming inspection: Sample according to GB2828/AQL standard to test the appearance, size, electrical performance of key materials such as substrate, copper foil, ink, etc. Unqualified materials are isolated and marked, and are strictly prohibited from being stored.

Abnormal handling: Respond to incoming material abnormalities within 48 hours, review return/exchange/special procurement/full inspection plans, and track corrective actions.

2. Process Quality Control (IPQC)

First piece confirmation: The first piece of each process is fully inspected and qualified before mass production can be carried out to prevent batch defects.

Full process inspection: covering inner layers, lamination, drilling, electroplating, wiring, solder mask, surface treatment, etc., AOI/X-RAY automatic detection, MES system real-time recording of defective data.

SPC dynamic monitoring: Real time monitoring of key parameters (line width, aperture, layer deviation), over limit warning, and immediate shutdown and rectification of Class A abnormalities.

Control of non-conforming products: Red identification is used to isolate defective products, distinguish rework/scrap, and prevent them from flowing into the next process.

3. Finished product quality control (FQC/OQC)

Complete inspection of finished products: inspection of appearance, size, conductivity, insulation, voltage resistance, impedance, and reliability (high and low temperature, humidity, vibration) in all aspects.

Shipment Inspection (OQC): Sample according to customer standards, check specifications, quantity, packaging, and issue a qualified report before shipment.

Traceability system: Full process batch records, products can be traced throughout the entire process, and the root cause of problems can be quickly identified.

4. Quality System and Continuous Improvement

Implement system standards such as ISO9001, IATF16949, ISO14001, ROHS, and ensure quality control for all employees.

Weekly quality analysis meeting, monthly CAPA review, data-driven continuous optimization, reducing defect rate.

Core technology and patent advantages

1. Core technical capabilities (high-end HDI/high multi-layer PCB)

HDI technology: first-order/second-order/third-order blind buried holes, micro vias (≤ 0.1mm), fine wire width/spacing (≤ 0.075mm), high-precision impedance control (± 5%), suitable for 5G, AI, and high-speed digital scenes.

High multi-layer technology: 4-20 layers of precision pressing, layer deviation ≤ 0.05mm; mature processes for thick copper (2-12oz), high TG (≥ 170 ℃), and high-frequency high-speed materials (PTFE, LCP).

Heat dissipation and integration technology: metal based (aluminum/copper) embedding, anodized insulation, thermal conductive boss design, high heat dissipation+miniaturization, suitable for high-power, vehicle mounted, and industrial control scenarios.

2. Authorized patents (core 2)

Invention Patent: Circuit Board and Its Preparation Method (CN202111167422.4, authorized on February 23, 2024) - Aluminum/Aluminum Alloy Thermal Conductive Component Embedding+Anodizing Insulation, Improving Heat Dissipation and Wiring Density, Achieving Miniaturization and High Reliability.

Utility model patent: Composite circuit board (CN202122401732. X, authorized on January 18, 2022) - insulation substrate+metal thermal conductive component+oxide insulation layer+thermal conductive protrusion, strong heat dissipation, large wiring area, compact structure.

3. Technical barriers

Precision manufacturing capability: dozens of precision processes, strong stability in high and low temperature/vibration environments, suitable for high reliability fields such as automotive electronics (autonomous driving, engine control), industrial control, medical, etc.

Material and process integration: Top grade substrate+self-developed process, high precision, low loss, high stability, recognized by many well-known car companies.

Service features (customization, full cycle, high responsiveness)

1. Customized solution services

Deep docking of requirements: The technical team communicates in advance and provides a one-stop solution for PCB design, material selection, and process optimization based on product scenarios (communication/automotive/industrial control/medical).

Flexible customization capability: supports small batch (sampling), medium batch, and large batch flexible production, with controllable delivery time (3-5 days for sampling and 7-12 days for batch).

Special requirements adaptation: Customization of special PCBs such as high TG, high frequency, thick copper, metal based, and heat dissipation structures to meet differentiated needs.

2. Full cycle technical support

Pre sales: Free DFM manufacturability analysis, design optimization suggestions, and avoidance of production risks.

During sales: Real time synchronization of production progress, communication and confirmation of key nodes to ensure compliance with expectations.

After sales: 24-hour technical response, quality issues resolved within 48 hours, lifelong technical consultation.

3. Quality and Delivery Assurance

Quality commitment: Full process quality inspection, defect rate ≤ 0.3%, 100% qualified upon delivery.

Stable delivery: sufficient production capacity, stable supply chain, and a delivery time achievement rate of ≥ 98%.

Compliance guarantee: The product complies with ROHS, REACH, UL and other certifications, and is suitable for the global market.

4. Deep industry cultivation and customer orientation

Industry Focus: Focusing on high-end HDI/high multilayer PCBs, deeply cultivating high value-added fields such as automotive electronics, industrial control, communication equipment, medical instruments, etc.

Customer classification management: strategic/important/general customer classification maintenance, specialized technical docking for key customers, long-term stable cooperation.