Process evolution of high-end HDI and high-multilayer PCBs reflects higher density, speed, and integration, progressing from traditional multilayers to 1st/2nd-generation HDI and any-layer HDI. Traditional multilayers (≤12 layers) use through-holes and ≥4mil lines for consumer/industrial electronics.
1st-generation HDI is entry-level: laser blind vias (1-2 layers) and 3mil lines meet smartphone/tablet needs. 2nd-generation HDI adds stacked/staggered vias (75μm apertures), 50% higher density for premium phones/GPUs.
Any-layer HDI is state-of-the-art: laser microvias between any layers, 30μm/30μm lines, and <0.4mm pitch BGA support for AI servers, ADAS, and aerospace. Equipment localization (laser drills, vacuum laminators, mSAP tools) has accelerated domestic high-end PCB output, rivaling global leaders.
