Materials define high-end HDI and high-multilayer PCB performance, especially in harsh environments. High-end substrates require high heat resistance (high Tg), low dielectric loss (Low Dk/Df), and high dimensional stability.
High-multilayer PCBs use high-Tg FR-4 (e.g., Shengyi S1000-2M, Tg170°C) to withstand repeated 180°C lamination, reducing misalignment from thermal expansion. High-frequency applications (5G, AI servers) use low-loss materials like M4/M7 or Rogers substrates to minimize signal loss for 10Gbps+ transmission.
HDI substrates prioritize thinness and reliability: build-up layers use <0.1μm dielectrics with laser microvias and plating for precision interconnection. Low-profile copper foil (Rz<2μm) reduces skin effect losses. Material innovation enables higher density, speed, and reliability, with domestic substrates replacing imports to lower costs.
