Manufacturing high-end HDI and high-multilayer PCBs is a systematic process of materials, processes, equipment, and testing, with each link determining product quality. High-multilayer PCBs face ultra-high stack precision challenges: 64-layer boards require staggered signal/power layer arrangements, with step lamination at 180°C/350psi to prevent misalignment and warpage.
HDI boards focus on high-density interconnection: laser microvias (50-100μm) need ±15μm alignment accuracy, while blind via plating requires <5% surface flatness error for stable stacking. Any-layer HDI enables free interlayer connection, providing extreme routing space for <0.4mm pitch BGAs.
Testing ensures quality: AOI, X-ray layer inspection, and impedance testing (±10% tolerance) verify compliance with IPC standards. Leading domestic enterprises now mass-produce 64-layer high-multilayer and any-layer HDI boards, breaking foreign monopolies and offering domestic alternatives for aerospace and high-end servers.
