High-end HDI and high-multilayer PCBs will evolve toward higher density, speed, reliability, and greenness, driven by AI, 5G, and autonomous driving, with vast growth potential.
Technology trends: 1) Extreme density: Any-layer HDI with <50μm vias, <20μm lines, and 40+ layers for 3D/Chiplet packaging; 2) High speed: Low-loss materials and advanced impedance control for 25Gbps+ transmission; 3) Enhanced reliability: High-performance materials for aerospace/autonomous driving; 4) Green manufacturing: Lead-free/halogen-free processes as standard.
Industry opportunities: Global capacity shifts to China, with domestic firms gaining share via tech/cost/capacity advantages; AI/6G/medical electronics drive sustained demand; import substitution accelerates, nurturing global leaders and industrial upgrading. High-end PCBs will be a core growth engine, empowering global smart electronics innovation.
