High-end HDI (High-Density Interconnect) and high-multilayer PCBs are core components supporting advanced electronic devices such as 5G equipment, AI servers, and autonomous driving systems. HDI boards feature microvias, fine lines, and high wiring density, while high-multilayer PCBs integrate complex circuits through stacks of 12+ layers. Their combination has become an industry standard, driving electronics toward miniaturization, high speed, and high reliability.
Manufacturing high-end HDI and high-multilayer PCBs hinges on overcoming precision engineering barriers. Material-wise, high-Tg (≥170°C), low-loss (Low Dk/Df) substrates like Shengyi S1000-2M are selected to ensure thermal stability and signal integrity. Process-wise, laser drilling (50-100μm apertures), precision lamination (±25μm layer alignment), and mSAP (semi-additive process) for fine lines (30μm/30μm) define product accuracy and performance.
Applications focus on high-performance sectors: AI servers use 20-30 layer ultra-high HDI boards for high-speed GPU interconnection; 5G base stations rely on high-multilayer PCBs for stable high-frequency signal transmission; autonomous driving ADAS modules integrate dense sensors and chips via HDI boards. As demand for device performance rises, technological iteration and capacity expansion of high-end PCBs will directly shape the global advanced electronics industry landscape.
